Hybrid-Multilayered PCB Laminated & PCB Assembly

For applications associated with instruments, Optical Communication,Networking and Telecommunication etc..
high Frequency, Low loss Tangent, HDI Process and Metal Core etc..
Board Materials: Rogers R3003 R4350B, TU, Megtrons 6, Isola series, IT, NanYa etc.

Chasis / Enclosure / Body

CNC machined Prototyping, Tooling, Molding,Mechanical ID Design etc...


Firmware & Driver Coding / App Developing